4-Layer rigid flex pcb for cell phone pcb Green / Blue Solder mask ENIG finish manufacturer from China Shen Zhen Hongfu Hua Technology Co., Ltd.

Place of Origin:

Zhejiang, China (Mainland)

Product Detail

4-Layer rigid flex pcb for cell phone pcb Green / Blue Solder mask ENIG finish

Quick Details

Place of Origin:	China (Mainland)	Brand Name:	OEM	Model Number:	H015K
Number of Layers:	4-Layer	Base Material:	PI	Copper Thickness:	1OZ
Board Thickness:	1.6mm	Min. Hole Size:	0.2mm	Min. Line Width:	0.1mm
Min. Line Spacing:	0.1mm	Surface Finishing:	ENIG	Solder mask:	Green/Blue/Black/White/Yellow/Red etc
Max size of finish board:	9200*900mm	Certification:	UL/SGS/ROHS	Controlled impedance:	±5%
Warp&Twist:	0.7%	Rang of finish boards thickness:	0.21~7.0mm	Layer count:	1~28
Impedance control:	±10%	OEM/ODM:	One-stop service	PCB standard:	IPC-A-610D

rigid flex pcb
a.PCB OEM&ODM Clone/Copy
b.PCB Design
c.Turnkey service
d.UL,SGS,RoSH,TS

rigid flex pcb

1.ENIG finish required to meet ROHS compliant;

2.PI material within 0.2mm-3.2mm boards thickness;

3.Copper weight:0.5OZ,1OZ,2OZ,3OZ;

4.0.2mm min finished hole size;

5.Certificate: UL, ROHS, T/S16949;
6.Company management: ISO9001:2000;
7.Markets: Europe, America, Asia etc all over the world.

PCB manufacturing capacity

NO	Item	Craft Capacity
1	Layer	1-28 Layers
2	Base Material for PCB	FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS , TEFLON, ARLON, Halogen-free Material
3	Rang of finish baords Thickness	0.21-7.0mm
4	Max size of finish board	900MM*900MM
5	Minimum Linewidth	3mil (0.075mm)
6	Minimum Line space	3mil (0.075mm)
7	Min space between pad to pad	3mil (0.075mm)
8	Minimum hole diameter	0.10 mm
9	Min bonding pad diameter	10mil
10	Max proportion of drilling hole and board thickness	1:12.5
11	Minimum linewidth of Idents	4mil
12	Min Height of Idents	25mil
13	Finishing Treatment	HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
14	Soldermask	Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.
15	Minimun thickness of soldermask	10um
16	Color of silk-screen	White, Black, Yellow ect.
17	E-Testing	100% E-Testing (High Voltage Testing); Flying Probe Testing
18	Other test	ImpedanceTesting,Resistance Testing, Microsection etc.,
19	Date file format	GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
20	Special technological requirement	Blind & Buried Vias and High Thickness copper
21	Thickness of Copper	0.5-14oz (18-490um)