Layer count

Single sided, Double sided, Multilayer to 26 Layers

Base material

FR4, High Tg FR4, CEM-3, Aluminum Base, Copper core, High frequency, Polyimide (PI), Polyester(PET) ,Rogers RO4350,Polyimide,Teflon,Getek Copper Clad Thermal Substrates

Board thickness

0.2mm, 0.4mm, 0.8mm, 1.0mm. 1.2mm.1.6mm.2.0mm-2.4mm, 3.2mm,4.0mm

Maximum Board Size

580mmx700mm

Copper thickness

0.5oz, 1oz, 2oz ,3oz., 4oz,5oz,6oz

Minimum Hole Size

0.2mm

Minimum Trace/Space

4mil/4mil

Surface finish 

HASL(Hot Air Solder Level), Pb Free HASL , Electroless Nickel and Immersion Gold (ENIG), Plating Gold, Gold Fingers (Gold Connector), Silver Immersion, Organic Surface Protectant (OSP), Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG),Hard Gold

Solder Mask

Green, Red, Blue, Black, Matte Green, Orange

Silk Screen

White, Yellow, Black

PCB Fabrication

Scoring, Route, V-Score, Counter Sink, Bevel, Cutouts and Slots

Quality Control

IPC 6012 Class 2, Electrical Testing, Flying probe Testing, 100% Netlist Testing

Special Technology

Impendence Control, Differencial PCB printed circuit board, Peelabemask PCB , High Density PCB HDI, Heavy copper PCB ,Metal Core circuit boards ,Copper Clad PCB printed circuit board, Blind & Buried Vias, Laser Drilled Vias, Burn-in Boards,Flex Boards, Rigid Flex PCB printed circuit board , Edge half plated thru hole Circuit boards, Selective Plating Hard Gold, Special Thin or Special Thick PCB board, PCB with Resin Plugged Hole